WS608

Features & Benefits


• Excellent activity allows for excellent soldering to ENIG and Cu OSP soldering process
• Excellent activity allows for pristine, and oxide free pre-cleaning of Cu-OSP soldering pads
• Superior wetting maximizing assembly yields to provide lowest missing ball rates
• Excellent material stability whereas the flux maintains tack and viscosity over multiple print cycles (without replenishment)
• Excellent clean-ability performance in that residues are easily cleaned with DI water
• IPC Halogen free formulation
  
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